SanSho | Korea

SMT: We provide outstanding reliability through surface-mount technology (SMT), which is a process of manufacturing technology of electronic products such as Home appliances, automotive, and mobile.

Micro Drill Micro drill (Resin, Ceramic Production): This is a micro drill for ceramics and resin production of small diameter drills (more than Ø10㎛). Precision production is possible because the micro drill customized for empty carriage and size with the high-precision and high-quality SUMITOMO drill.

PHOTOVEEL Machinable Ceramics(Material, Processed Goods): We supply series of Photoveel, machinable ceramic of Ferrotec Ceramics, which is widely used as guide plating for probe card and sockets. The machinable ceramics can be provided through laser processing and hole processing.

WAFER Compound Semiconductor: Compound Semiconductor is the main material of communication technology and lighting such as LED and LD. The company provides compound semiconductor wafers such as GaAs/InP/GaN, products of SUMITOMO.

Adhesive Secondary battery adhesive: Secondary battery adhesive uses acryl and epoxy as raw materials and becomes hardened in a short period of time due light energy. It is a resin that plays the role for adjusting high precision, dampproof, and protection. Resin can be selected according to use such as high-purity and high-transparency.

Copper powder For Board Plating: It is a copper oxide black powder that is used for printed Circuit Board (PCB) plating and catalyst. It is a patent product with superior flow, low CI concentration, and quick melting rate (within 10 seconds) in which it is a very appropriate product to be used for electric gilding and electroless plating.

Susceptor wafer tray: Wafer tray is a siC coating technology that uses CVD-SiC (爐) and acquires susceptor company, core part of LED MOCVD equipment, CVD-SiC parts, and Dummy-Wafer used for semiconductor diffusion process.

Bonding Tool For Chip Mounting of Film: It is a SUMITOMO Bonding tool for COF mounting. It is a product that uses CVD diamond as fleet and it has high reliability of flatness.

CEPLA PI Affiliated Resin: The heat resistant PI resin CEPLA is a material formed of multidirectional polyimide resin due to diamine and BPDA (biphenyl-tetracarboxylic acid dianhydride). It is heat resistant and has outstanding mechanical characteristic, electric characteristic, expansion, machine productivity, radioactivity resistance, chemical resistance, and water resistance to be used in many areas.

L/F , IMB MOLD Molded Part of Metal and Resin: The product provides fine molding parts to weight lightening and heat-resistance through molding of metals and resin. Use: Automotive material and mobile.

case Actuator Part Case in Mobile Phones: All core products produced through press processing and fine plate processing from the parts that go into the mobile are produced.

DIES Tool for Wire Drawing: Diamond dice of 'ALMT Corp' with the ability of mass production through diamond gemstone and highest market shares in the world are provided. Use: Soft and hard wire such as Au, Cu, SUS, and PCC

FFC heat-resistance, wetproof FFC: Wiring material of high reliability while it is thin is provided as electronic machine product to be led as small, light, and multi-function. As products specialized to high heat-resistance and high temperature/high humidity, high competitiveness can be boasted compared to other wiring material products.

Laser Diode Laser Diode for Automotive: Laser diode of wavelength (450mw~940mw) of high power range is provided for automotive and mobiles.

Carrier Tape Paper Carrier Tape: Carrier tape and related materials used for semiconductor chip and electronic parts packaging are handled.

DCS sheet Resin Sheet for Carrier Tape: DCS sheet that is used for carrier tapes for packing of electronics, chips, and etc.

PVC Material PVC Pellet: As pellet material that becomes a raw material of PVC molded parts, the product is provided at an inexpensive price according to the specification and request of the customer such as color and strength.

LGF Light guide film: As a light guide film with dot viscosity technology to flexible reflective film, it is used for backlight of industrial products and advertisement panel.

AL Packing Materials For Packing: We will suggest planning, design, and manufacturing for wiring subsidiary materials such as communication, power, and automotive. We respond to slitting processing, coding, and laminate for plastic extrusion molding, industrial plastic film, and metal foil.

SiN Board For Power Module: The TOSHIBA material's silicon nitride ceramics board combined high-strength and high-radiant heat of the world's best quality. It is used in electronics field such as power semiconductor module, inverter, and converter and it can be replaced with other insulation to implement high output, minimization, and light weight. Also, the strength is very high and it is a key material that supports increase of reliability and long lifespan of application.

AlN Board For Power Module: It is an aluminum nitride ceramic board that has high radiant heat of the world's best quality. It is a product with high heat conductivity of 160 ~ maximum value 255W/m · K which can be especially appropriate for parts that need thickness of the board with high withstand voltage that needs radiant heat. Also, it is best for semiconductor mounting board while expansion rate is close to Si, SiC, GaN, and GaAs.

SiN Insulation Circuit Board For Power Module: It is an insulation circuit board that forms copper circuits to silicon nitride ceramics with high radiant heat and strength of the world's best quality. The ceramic board strength is high and the copper circuit thickness can be from 0.1mm to maximum of 0.8mm. It has high radiant heat where it is the key material to make high output and minimization of power module possible. Also, it has outstanding heat-resisting cycle for long lifespan. It can be used for various structures such as adjustment of screw by making a hole, copper base, and ultrasonic (US) joint of copper electrode terminal of power module.

AlN Sub-Mount Radiator for Laser and Radiator: It is a thin film metal board that uses aluminum nitride ceramic with high radiant heat of the world's best quality. The product provides 'sub mount' with Au bump, formation of AuSn solder pattern, and Ti/Pt/Au thin film. It is also used for high power LED for head lamp in LED for general lighting including laser diode. Recently, it is also applied in different fields as a board for mounting such as violet LED (Sterilization Lamp / Resin Light Lamp) for high radiation.

Noise Suppression Element AMOBEADS® ・SPIKE KILLER®®: Switching Power (Secondary Output Diode), Switching Power, DC/CD Converter, Motor Control Circuit, Automotive Material Motor Actuator
Noise suppression parts [AMOBEADS®]・[SPIKE KILLER®] have high noise suppression effect than the CR Snubber and the FERRITE BEADS where it is appropriate for harmonic wave regulation. Especially, MOSFET and [AMOBEADS®] of directly putting in the diode's lead is not possible to produce as board where it is possible to respond to emergency noise measures. Also, there is also [SPIKE KILLER®] in the lineup that displays more noise suppression effect than [AMOBEADS®].

Extremely low temperature magnetic cold storage material: MRI Diagnosis Device, Magnetic Suspension System, Cryo Pump, Communication Superconductivity Filter, Superconductivity Power Storage Device, Other Extremely Low Temperature Usage Device (Superconductivity Application Device), GM (Giffor-McMahon) Freezer, Pulse Pipe Freezer
Magnetism Cold Storage medium shows high specific heat peak according to the difference of the autoscopy. According to application of this Magnetism Cold Storage medium to the GM (Gifford-McMahon) freezer, it has become possible to create freezing ability on the liquid helium temperature (4.2K). when 4KGM is used on the super conductivity MRI (Magnetic Resonance Imaging), zero boil OFF can be implemented to make liquid helium evaporation into 0.

Rhenium Tungsten (Rheni-tung®) target (Rotanode): Medical X-ray Tube (CT scanner, circulative device, general X-ray tube)
Tungsten has high melting point where it is widely used for X-ray creating source of various x-ray tubes for security and medical device since X-ray is created at high speed. In TOSHIBA MATERIAL, Rheni-tung® alloy and molybdenum alloy are combined with the graphite to change. The light-weighted Rheni-tung®/graphite targets are being manufactured. This target is used for x-ray tube for medical use.

Probe Pin High-density direct circuit inspection for semiconductor/liquid crystal panel.: Tungsten is used for probe pin (contact pin) for inspection of high-density direct circuit of semiconductor and liquid crystal panel as a metal with abrasion and high strength. In TOSHIBA MAERIAL, lenin is added to tungsten to develop Rheni-tung®, which increased the performance. It has the characteristics of high hardness and high conductivity where it is the best probe pin with smooth pin due to the small amount of element control.

Rhenium Tungsten (Rheni-tan®) wire: Probe Pin, Various testing fixtures, display tube, heater for electron tube
Rhenium and Tungsten have different electric resistance and machine characteristics where the electric resistance and machine characteristics of rhenium tungsten alloy differ according to the addition of tungsten and rhenium. TOSHIBA MATERIAL has lineups set for wire of appropriate material according to each use.

Torie Ted Tungsten (Toritan®) electric discharge electrode: Xe Lamp for digital cinema project
Torie Ted Tungsten (Toritan®) is very superior in electric radioactivity where it is appropriate for electrode of lighting. In TOSHIBA MATERIAL, Xe lamp electrode used for projects for digital cinema or photo resource used for pattern molding of semiconductor is produced.

Torie Ted Tungsten (Toritan®) Wire Mill-type Lamp Filament, Electric Tube: In TOSHIBA MATERIAL, Torie Ted Tungsten (Toritan®) Wire is manufactured with superior machinery characteristics at high temperature.

Torie Ted Tungsten (Toritan®) Electrode TIG Welding Electrode, Electric Discharge Electrode: Torie Ted Tungsten (Toritan®) is very superior in electric radioactivity. It has a characteristic of low electrode consumption due to less welding because the electrode temperature is low and that the arc occurrence is easy when used as an electrode. In TOSHIBA MATERIAL, TIG welding electrode and electric discharge electrode are manufactured.

Tungsten Target (Anode) X-ray Tube for medical use, X-ray Tube for analysis: Tungsten has high solubility point where it is used for anode of X-ray tubes in the aspect that the ray occurs when inspecting the high speed electric ray. In TOSHIBA MATERIAL, these characteristics are saved to manufacture X-Ray Tube Anode for analysis and for orthodontist.

Pure Tungsten TIG Welding Electrode (Welding Rod) TIG Welding Electrode: Tungsten has high solubility point where it is used as electrode (welding rod) of TIG welding. In TOSHIBA MATERIAL, general TIG welding electrode such as direct polarity, flat interchange and direct specific welding are manufactured.

Heavy Alloy ® Parts: X-ray device for medical use/industrial use, y-ray device radioactivity enclosure, element container, balancer, fly foil, boaring bar, quill for internal grinding, molding part for die caster, pin, sleeve, various electrode, fixturing for heat treatment
Heavy Alloy ® is added with Ni, Cu, and Fe in tungsten and is a material that sintered high density. It is used in various fields with superior machinery characteristic, radioactivity enclosure, and heat-resisting property. In TOSHIBA MATERIAL, superior radioactivity enclosure is used to resist the collimeter parts and high density to manufacture various heavy alloy parts such as balancer parts.

Molybdenum Part: IGBT (Insulation Gate Bipolar Transistor) Molybdenum Disc, X-ray Device Enclosure Subsidiary Material, Electrode with Glass Fusion, High-temperature subsidiary material, artificial mesh antenna
In TOSHIBA MATERIAL, various molybdenum parts have been manufactured through powder sintering technology that has been accumulated over a long period of time. Molybdenum Parts have thermal expansion coefficient close to Si where it has outstanding heat radiation. Therefore, it is used as subsidiary material of IGBT (Insulation Gate Bipolar Transistor)

Ti Target for Semiconductor Device For Semiconductor Device: It is a sputtering target for thin film device that contributes to high-function of various terminal parts. It is used to optimize the target surface status and the fine and equal metal parts where low particles were implemented from beginning to end of use.

CrAIX Alloy Target for hard thin film Protection film for molding: We implement films with low decline of hardness even in high temperature due to the element effect. The best dural mater is formed to the long life of the parts for molding.

Spraying Treatment: Chamber durability part of sputtering device, semiconductor, liquid crystal, manufacturing line of magnetic record, Home appliances (durability of abrasion, heat conductivity, acoustic feature), VTR drum, speaker, IH utensils, hot plate, automotive parts (durability of abrasion, corrosion resistance, heat-resisting property), guide roll for bronze manufacturing device, guide pin, roller table, other paper, calendar roll for printing manufacturing device, doctor blade and etc.
Sputtering device is an important assessment for productivity increase due to the increase of lifespan of components (mold plate) within the chamber and increase of retention due to decrease of particles (minute particles). To resolve these assessments, HRG treatment technology or HAS treatment technology has been developed to apply to component parts within the chamber.

High Speed Solid Deposition of Particle Ceramics Coating: Component within chamber of semiconductor manufacturing device (plasma, heat-resisting property, radiant heat), increase of retention and expansion of lifespan due to particle decrease (material: Y2O3), components within the chamber of LED manufacturing device (plasma, heat-resisting property, radiant heat), FPD, increase of retention and expansion of lifespan due to particle decrease (material: Y2O3), COST reduction of insulation parts for heat-resisting components (Material: AI203)
High Speed Solid Deposition of Particle is used where it is now possible to implement ceramic coating. High Speed Solid Deposition of Particle is the technology of forming film through solubility on the raw material surface due to impact energy by supersonic speed of the raw material. Compared to the plasma solubility, it can form film without barely any micro cracks.

thermo couple: Temperature measurement for industrial use, aviation, temperature measurement within the engine room, various fine temperature measurement
TOSHIBA MATERIAL's thermo couple has high insulation property, domestic environment, and machinery strength. It is used widely from general industrial use temperature measurement to exhaust gas temperature measurement for aviation engine. Thermo Couple is a structure that placed filling as high-density within the metal protection tube along with the high-purity magnesia powder. Therefore, it has strong mechanism, environment, and insulation property to be used in different ways.

AIC Composite Wood For Jig: Originally, this technology is used to make aluminum alloy with better characteristics. This liquid metal forging technology is used to make compound materials of carbon and aluminum. It is the process of combining aluminum through high pressure to the free home and thus making compound material of carbon and aluminum. As a material that changes to graphite zig, the characteristic of ACM-i that manufactures ACC can be easier to handle than graphite. There is less oscillation compared to the graphite and plating is also possible. The characteristic of high strength resolves the inconvenience of controlling graphite. Also, the heat expansion is lower compared to the SUS where there is no error in value when heated and there is the advantage of being light weight.

Vacuum related parts: Coil of Tungsten and Molybdenum material used for vacuum for final resistance heating. Used for surface treatment such as mirrors, accessories, automotive lamps, and mobile phone cases.

Tab Lead LIB battery electrode: SUMITOMO Tab lead is a lean wire for lithium ion battery for film type laminating PP film to the exterior of AI, Ni conductor. The film is in the structure of two layers, the adhesive layer and heating layer. Heat transformation is suppressed and has superior adhesion with the conductor. Also, it maintains internal electrolytes through surface treatment to the conductor.

Al Wire Battery Cable: Battery Cable is manufactured with consistent process in raw material solubility of the aluminum allow wires. The technology was developed exclusively through continuous cast rolling method. This product is widely used for welding, insulation, and cutting in shipbuilding field, electronic components, bicycles, and automotive.

CP Wire For communication: CP Wire is a special wire that has been made of ratio of 20%~60% copper layer weight to the aluminum. The heat conductivity and electric conductivity characteristics are superior and has high machinery property of strong material. It is used for rectifier diode, lighting bulb, and coaxial cable.

READ SWITCH Automotive Material RESERVE TANK: This is a lead switch that is used for proximity sensor and label sensor. It has the structure of countering the lead of the magnetic substance to the glass pipe where it responds to magnetism to open and close the point of contact. The point of contact acquires high reliability of not being influenced by the surrounding environment.

Perfluoroelastomer (FFKM) Special elastomer parts: Elastomer products that have been completely fluoridated with tolerance to gas, liquid (acid, alkali) and other environment. They are used generally in chemical/aviation business, oil manufacture, and semiconductor.

FPCB FLEXIBLE PCB: The FPC of SUMITOMO major product of forming electric circuit on top of the slim insulation film provides light weight of the electric devices such as hard disk, optical pickup, and mobile phones.

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